Aluminum Nitride (AlN) – The Core of Heat Dissipation for High-Power Electronic Devices

* Material Properties: Extremely high thermal conductivity (theoretical value up to 320 W/m·K, actual products can reach over 170 W/m·K), excellent electrical insulation, and a thermal expansion coefficient that matches well with silicon (Si).

* Application Background: Substrates and packaging materials for large-scale integrated circuits, high-power LEDs, and power modules. Effectively solves the heat dissipation problem of high-density components, with low thermal stress on the chip, high reliability, and is an ideal choice for high-performance microelectronic packaging.